LOCTITE^® TCF 14001

Silicone-based, thermally conductive gap filler

This silicone-based, thermally conductive gap filling material is designed for applications requiring high thermal transfer and low compressive stress.

技术 (1)

LOCTITE^® TCF 14001 en_GL

RoHS (2)

法规 (2)

部件编号 (SKU/IDH)
3023771

IDH 名称：
导热胶LOCTITE TCF 14001

使用的所有商标均为汉高及其附属公司在美国、德国和其他国家/地区的商标和/或注册商标。

信息

说明
技术规格

LOCTITE^® TCF 14001 is a 2-part, brown (when cured), silicone-based gap filler. It is designed for telecom, datacom, power, and automotive applications requiring high thermal transfer and low compressive stress. The product offers infinite thickness variation and imparts little to no stress on sensitive components during assembly. It cures at room temperature (no oven required) to form a stable adhesion between interfaces. The curing process can be accelerated with the addition of heat. It is a soft and flexible material that maintains its properties over time.