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Henkel Adhesive Technologies

Henkel Adhesive Technologies

Compounds for electronics

Henkel electronic materials encompass potting compounds and conformal coatings designed for modern circuitry. They provide essential insulation, moisture resistance, and anti-aging properties. These materials are formulated for the encapsulation and protection of electronic components, ensuring reliable performance in demanding environments.

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  • Water based adhesives

    AQUENCE® LA 21021

    Pressure-sensitive adhesive for flexible packaging and labeling

  • Water based adhesives

    AQUENCE® LA A8065M

    Synthetic dispersion adhesive for laminating paper for filters

  • A packshot of BERGQUIST HI FLOW THF 1600P showing green sheets, die cuts, and die cut roll.

    Phase change materials

    BERGQUIST® HI FLOW THF 1600P

    High performance, electrically insulating, reinforced pad

  • Phase change materials

    BERGQUIST® HI FLOW THF 5000UT

    Thin bond line, low pressure - for advanced devices

  • A packshot of BERGQUIST LIQUI BOND TLB SA2005RT showing red and blue 50CC, 200CC, and 400CC kits.

    Thermally conductive adhesives

    BERGQUIST® LIQUI BOND TLB SA2005RT

    Dispensable liquid for structural component bonding - high performance

  • X Front view of a 25 kg BONDERITE C-IC METCH can with a white lable, blue body

    Functional coatings

    BONDERITE® C-IC METCH

    Acid etching cleaner for removing oxide films from magnesium

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