Silicone-free thermal management for sensitive environments
Discover how Henkel's silicone-free BERGQUIST GAP PAD TGP 2200SF tackles thermal challenges, ensuring stress control, heat dissipation, and high reliability in the production of 50,000 versatile Programmable Logic Controller units annually.
Controlling heat saves money while boosting network speed
Heat is the enemy of circuit boards. Leaps in board density, driven by never-ending demand for bandwidth, make the problem worse. Minimizing the aggregate heat generated by components has a lot of benefits: It improves the integrity of circuit boards, reduces cooling expenses, and lowers repair and maintenance costs. What’s not to like?
