Phase change material reliably manages heat in motor controllers
Discover how Henkel's Bergquist® HI-FLOW THF 1600P tackles challenges in modern motor controllers with high reliability, simplified handling, and long-term integrity.
Phase change interface materials for next-gen data center ICs
This case study looks at how low-pressure, low thermal impedance, phase change thermal interface material provides a much-needed solution for next-gen data center ICs.
Discover how Henkel's advanced thermal management solutions play a crucial role in ensuring the reliability and performance of these charging stations, making EV adoption more convenient and environmentally responsible.
Controlling heat saves money while boosting network speed
Heat is the enemy of circuit boards. Leaps in board density, driven by never-ending demand for bandwidth, make the problem worse. Minimizing the aggregate heat generated by components has a lot of benefits: It improves the integrity of circuit boards, reduces cooling expenses, and lowers repair and maintenance costs. What’s not to like?
