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Advanced packaging: market evolution and material solutions

Learn how Henkel’s innovative materials are paving the way for the future of advanced semiconductor packaging in a rapidly evolving tech landscape.

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Board-level material solutions

Explore our materials that protect componentry from mechanical shock, thermal impact, and other environmental factors.

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From imaging to future ready applications

Henkel offers the most robust total solution portfolio to respond to all aspects of camera module & sensor assemblies.

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Adhesives for electronics components

Explore our electrically conductive adhesives (ECAs) & non-conductive adhesives (NCAs).

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Advanced packaging for AI

Henkel, a leading semiconductor materials supplier, drives AI and computing advancements with innovative adhesives and encapsulants. Dr. Kefan Ni discussed with Singapore Semiconductor Industry Association (SSIA) on trends in AI package development and future innovations for enhanced performance and reliability.

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800G/1.6T optics powering AI revolution

Explore how 800G and 1.6T optics are helping turn AI evolution into revolution by enhancing data center speed and efficiency. Discover how Henkel are driving innovation to meet the growing demands of AI applications.

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