Skip to Content
Henkel Adhesive Technologies

Henkel Adhesive Technologies

Thermal management materials

Henkel thermal management materials include thermally conductive gels and gap fillers that deliver excellent heat dissipation. They are specifically formulated to meet the cooling requirements of electronic devices and new energy components. These materials ensure reliable thermal transfer for sensitive applications.

Filters

Related products

  • LOCTITE 401瞬干胶

    Instant adhesives

    LOCTITE® 401

    Your go-to fast-fixturing adhesive

  • LOCTITE 402瞬干胶

    Instant adhesives

    LOCTITE® 402

    Ultra performance

  • A packshot of LOCTITE ECCOBOND E 1172, an off-white material in 3 different sizes showing a 55CC syringe, a 30CC syringe, and a 10CC syringe.

    Underfills

    LOCTITE® ECCOBOND E 1172 A

    Void-free underfill for very fine area array devices

  • A packshot of LOCTITE ECCOBOND FP4531, a black material in 3 different sizes showing a 55CC syringe, a 30CC syringe, and a 10CC syringe.

    Underfills

    LOCTITE® ECCOBOND FP4531

    Underfill compatible with small gap sizes

  • A packshot of LOCTITE ECCOBOND UF 1173 showing black 10 and 55CC syringes.

    Underfills

    LOCTITE® ECCOBOND UF 1173

    Void-free epoxy underfill

  • LOCTITE ECCOBOND UF 9000AG

    Underfills

    LOCTITE® ECCOBOND UF 9000AG

    Underfill encapsulant for flip-chip BGA and Cu pillars

Related articles