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Henkel Adhesive Technologies

Henkel Adhesive Technologies

Thermal management materials

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  • Loctite 401 - 20g Bottle (IDH 1659311)

    Instant adhesives

    LOCTITE® 401

    Your go-to fast-fixturing adhesive

  • LOCTITE 402 Instant Adhesive - 20 g Bottle (IDH 2714621/2714623)

    Instant adhesives

    LOCTITE® 402

    Ultra performance

  • A packshot of LOCTITE ECCOBOND E 1172, an off-white material in 3 different sizes showing a 55CC syringe, a 30CC syringe, and a 10CC syringe.

    Underfills

    LOCTITE® ECCOBOND E 1172 A

    Void-free underfill for very fine area array devices

  • A packshot of LOCTITE ECCOBOND FP4531, a black material in 3 different sizes showing a 55CC syringe, a 30CC syringe, and a 10CC syringe.

    Underfills

    LOCTITE® ECCOBOND FP4531

    Underfill compatible with small gap sizes

  • A packshot of LOCTITE ECCOBOND UF 1173 showing black 10 and 55CC syringes.

    Underfills

    LOCTITE® ECCOBOND UF 1173

    Void-free epoxy underfill

  • LOCTITE ECCOBOND UF 9000AG

    Underfills

    LOCTITE® ECCOBOND UF 9000AG

    Underfill encapsulant for flip-chip BGA and Cu pillars

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