Case study

Improving power module reliability with LOCTITE^® phase change material

Learn how a new drive system design removed operational heat with thermal management materials.

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An example application of phase change materials.

Customer challenge

The customer’s new drive system design had a higher power density than prior versions and required a reliable, efficient mechanism to remove operational heat. Previous experience with conventional thermal grease suggested that, due to inherent material migration (also known as ‘pump out’), a grease thermal interface would not deliver the reliability and performance required. Improvements in manufacturing efficiency were also objectives of the customer.

Key results

Successful testing in -50˚ to 150˚C power cycling without any failure
Chip's temperature did not exceed 125˚C even after 1,000 hours
Thermal impedance value of 0.062 making thermal transfer more effective
Can be applied via stencil printing, allowing an automated, multi-device material application process
Once the phase change material is dried, devices can be stored until needed for system integration

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