Part no. (SKU/IDH):
3023771
IDH Name:
LOCTITE TCF 14001
Thermal gap fillers
Silicone-based, thermally conductive gap filler
This silicone-based, thermally conductive gap filling material is designed for applications requiring high thermal transfer and low compressive stress.
Part no. (SKU/IDH):
3023771
IDH Name:
LOCTITE TCF 14001
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
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- Description
- Technical specification
LOCTITE® TCF 14001 is a 2-part, brown (when cured), silicone-based gap filler. It is designed for telecom, datacom, power, and automotive applications requiring high thermal transfer and low compressive stress. The product offers infinite thickness variation and imparts little to no stress on sensitive components during assembly. It cures at room temperature (no oven required) to form a stable adhesion between interfaces. The curing process can be accelerated with the addition of heat. It is a soft and flexible material that maintains its properties over time.
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2-part: mixing required
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For applications requiring high thermal transfer
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Service/operating temperature: -40°C to 200°C (-40°F to 392°F)
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Low modulus
- Product category:
- Thermal gap fillers
Technologies:
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Thermal management, ultra high viscosity liquids
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