Part no. (SKU/IDH):
2981696
IDH Name:
BERGQUIST® GAP FILLER TGF 10000, 1200 cc Mixed
Thermal gap fillers
Silicone-based gap filler for electronics cooling applications
This silicone-based 2-part gap filler is specially designed for sensitive electronics cooling applications and has market-leading batch-to-batch flow stability.
Marketing materials
Part no. (SKU/IDH):
2981696
IDH Name:
BERGQUIST® GAP FILLER TGF 10000, 1200 cc Mixed
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
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- Description
- Technical specification
BERGQUIST® GAP FILLER TGF 10000 is a 2-part, thermally conductive, silicone-based liquid interface material for electronics cooling applications. You can expect easy dispensing and assembly, and excellent thermal reliability. Formulated for low volatility and long-term reliability in sensitive electronics, it is designed for high dispense rate and high batch-to-batch flow stability.
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High thermal conductivity
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Good dispensing efficiency
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High thermal reliability
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For telecom, computing, consumer electronics applications
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2-part: mixing required
- Product category:
- Thermal gap fillers
Technologies:
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Ultra high viscosity liquids
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