Part no. (SKU/IDH):
1375081
IDH Name:
LOCTITE® ABLESTIK 2332-17
Electrically non-conductive adhesives
Solvent-free epoxy adhesive for a wide variety of substrates
This 1-part, black epoxy adhesive for assembly bonds to a wide array of substrates, such as copper, aluminum and nickel.
Part no. (SKU/IDH):
1375081
IDH Name:
LOCTITE® ABLESTIK 2332-17
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
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- Description
- Technical specification
LOCTITE® ABLESTIK 2332-17 is a solvent-free epoxy adhesive for assembly bonding. It bonds to a wide variety of surfaces, including copper, aluminum, nickel, FRP, rigid plastics and oily steel. The product develops high bond strength when cured at temperatures as low as 100°C to 130°C (212°F to 266°F). It combines flexibility at low temperatures plus high peel and tensile shear strength over a broad temperature range.
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1-part: no mixing required
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Solvent-free
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Multi-substrate
- Product category:
- Electrically non-conductive adhesives
Technologies:
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Electronics assembly materials
- Cure schedule, Recommended, @ 120.0 °C:
- 1.0 h
- Cure type:
- Heat cure
- Number of components:
- 1 part
- Operating temperature:
- 150.0 °C
- Recommended for use with:
- Fiberglass reinforced plastic (FRP)
- Shear strength, Aluminum:
- 1740.0 psi
- Storage temperature:
- 0.0 °C - 8.0 °C
- Viscosity, @ 25.0 °C:
- 75000.0 mPa·s (cP)
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