Advanced packaging is at the heart of AI’s rapid progress, delivering systems with remarkable interconnect density and ultra-high bandwidth. Without these advances, the accelerated innovation driving massive compute performance would stall. What’s even more staggering is that AI high-performance computing systems are only beginning to approach their ultimate potential.
But what will future packaging structures look like, and how will they be achieved? With slowing transistor scaling and the shift to large multi-chiplet 3D designs, emerging architectures are placing new demands on designers, manufacturers, and integrators.
What to Expect
In this webinar, Henkel materials experts will share market trends and innovations shaping the future complexities impacting every AI package designer and engineer, and present the solutions being developed to address them.
Why it Matters
Design changes are scaling fast, and the engineers who can tackle the enabling processing, protection, and thermal challenges of next-gen AI packages will be ahead of the game. Join this webinar to ensure you’re up-to-speed.
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Founder & President, 3D System Scaling LLC
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With a B.S. from the Indian Institute of Tech, Bombay, and a Ph.D. from the Georgia Institute of Technology, Venky Sundaram is a seasoned executive with over 25 years of global experience in the semiconductor industry and cutting-edge technologies. He is renowned for his expertise in AI, high-performance computing, automotive electronics, 5G communications, IoT, and advanced battery materials. Venky has a distinguished track record in leadership and C-suite advisory, specializing in disruptive innovation and semiconductor ecosystem development. He co-founded Jacket Micro Devices, a pioneering RF/5G startup acquired by Kyocera/AVX, and spearheaded the commercialization of Glass Packaging, establishing a new industry ecosystem.
Head of Market Strategy - Semiconductor Packaging, Henkel
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Ram Trichur is the global head of semiconductor packaging market segment at Henkel. He is responsible for the key strategic and financial objectives for this segment. He has more than 20 years of experience in the microelectronics industry covering both the front-end manufacturing and backend assembly processes. He has 3 patents and has published more than 50 publications and articles in leading conferences and industry magazines. He received his master’s degree in Electrical Engineering from University of Cincinnati and completed his executive education in business management from Stanford University’s Graduate School of Business.
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