LOCTITE® ECCOBOND UF 3812
Features and Benefits
This 1-part, reworkable epoxy underfill encapsulant is designed for Ball Grid Array (BGA), Chip Scale Packaging (CSP) and Wafer Level Chip Scale Package (WLCSPs) production. It is compatible with most lead-free solders.
LOCTITE® ECCOBOND UF 3812 is a halogen-free underfill that shows stable performance under thermal stress. This black-liquid, epoxy-based underfill showcases excellent thermal cycle performance and sturdy electrical performance under thermal and humid bias. It can be used with most Pb-free solders; is designed for the production of BGA, CSP and WLCSPs, and is formulated to flow at room temperature with no additional preheating required.
Read More
Documents and Downloads
Looking for a TDS or SDS in another language?
Technical Information
| Applications | Encapsulating, Underfilling |
| Coefficient of thermal expansion (CTE), Above Tg | 175.0 ppm/°C |
| Coefficient of thermal expansion (CTE), Below Tg | 48.0 ppm/°C |
| Colour | Black |
| Cure schedule, @ 130.0 °C | 10.0 min. |
| Cure type | Heat cure |
| Glass transition temperature (Tg) | 131.0 °C |
| Pot life | 3.0 day |
| Storage modulus, DMA @ 25.0 °C 3-point bending | 3004.0 N/mm² (435580.0 psi ) |
| Storage temperature | -20.0 °C |
| Viscosity, Physica @ 25.0 °C Spindle CP50-1, Shear Rate 1,000 s⁻¹ | 350.0 mPa·s (cP) |
| Work life | 1.0 day |
LOCTITE® ECCOBOND UF 3812
This 1-part, reworkable epoxy underfill encapsulant is designed for Ball Grid Array (BGA), Chip Scale Packaging (CSP) and Wafer Level Chip Scale Package (WLCSPs) production. It is compatible with most lead-free solders.