LOCTITE® ECCOBOND UF 3812
Merkmale und Vorteile
This 1-part, reworkable epoxy underfill encapsulant is designed for Ball Grid Array (BGA), Chip Scale Packaging (CSP) and Wafer Level Chip Scale Package (WLCSPs) production. It is compatible with most lead-free solders.
LOCTITE® ECCOBOND UF 3812 is a halogen-free underfill that shows stable performance under thermal stress. This black-liquid, epoxy-based underfill showcases excellent thermal cycle performance and sturdy electrical performance under thermal and humid bias. It can be used with most Pb-free solders; is designed for the production of BGA, CSP and WLCSPs, and is formulated to flow at room temperature with no additional preheating required.
Weiterlesen
Dokumente und Downloads
Suchen Sie nach einem TDS oder SDS in einer anderen Sprache?
Technische Informationen
| Anwendungen | Unterfüllung, Verkapselung |
| Aushärtetechnik | Aushärtung durch Wärme |
| Aushärtezyklus, @ 130.0 °C | 10.0 Min. |
| Farbe | Schwarz |
| Glasübergangstemperatur (Tg) | 131.0 °C |
| Lagertemperatur | -20.0 °C |
| Speichermodul, DMA @ 25.0 °C 3-point bending | 3004.0 N/mm² (435580.0 psi ) |
| Topfzeit | 3.0 Tag |
| Verarbeitungszeit | 1.0 Tag |
| Viskosität, Physica @ 25.0 °C Spindle CP50-1, Shear Rate 1,000 s⁻¹ | 350.0 mPa.s (cP) |
| Wärmeausdehnungskoeffizient (CTE), Above Tg | 175.0 ppm/°C |
| Wärmeausdehnungskoeffizient (CTE), Below Tg | 48.0 ppm/°C |
LOCTITE® ECCOBOND UF 3812
This 1-part, reworkable epoxy underfill encapsulant is designed for Ball Grid Array (BGA), Chip Scale Packaging (CSP) and Wafer Level Chip Scale Package (WLCSPs) production. It is compatible with most lead-free solders.