LOCTITE® ECCOBOND UF 3812
Savybės ir privalumai
This 1-part, reworkable epoxy underfill encapsulant is designed for Ball Grid Array (BGA), Chip Scale Packaging (CSP) and Wafer Level Chip Scale Package (WLCSPs) production. It is compatible with most lead-free solders.
LOCTITE® ECCOBOND UF 3812 is a halogen-free underfill that shows stable performance under thermal stress. This black-liquid, epoxy-based underfill showcases excellent thermal cycle performance and sturdy electrical performance under thermal and humid bias. It can be used with most Pb-free solders; is designed for the production of BGA, CSP and WLCSPs, and is formulated to flow at room temperature with no additional preheating required.
Aprašymas
Dokumentai ir atsisiuntimai
Ieškote TDL arba SDL kita kalba?
Techniniai duomenys
| Darbo laikas | 1.0 diena |
| Kietėjimo planas, @ 130.0 °C | 10.0 min. |
| Kietėjimo tipas | Kietėjimas veikiant šilumai |
| Klampumas, Physica @ 25.0 °C Spindle CP50-1, Shear Rate 1,000 s⁻¹ | 350.0 mPa.s (cP) |
| Laikymo temperatūra | -20.0 °C |
| Pritaikomumas | Sandarinimas, Užpildymas ne iki galo |
| Saugojimo modulis, DMA @ 25.0 °C 3-point bending | 3004.0 N/mm² (435580.0 psi ) |
| Spalva | Juoda |
| Stiklėjimo temperatūra (Tg) | 131.0 °C |
| Tinkamumo naudoti trukmė | 3.0 diena |
| Šiluminio plėtimosi koeficientas (CTE), Above Tg | 175.0 ppm/°C |
| Šiluminio plėtimosi koeficientas (CTE), Below Tg | 48.0 ppm/°C |
LOCTITE® ECCOBOND UF 3812
This 1-part, reworkable epoxy underfill encapsulant is designed for Ball Grid Array (BGA), Chip Scale Packaging (CSP) and Wafer Level Chip Scale Package (WLCSPs) production. It is compatible with most lead-free solders.