LOCTITE® ECCOBOND UF 3812
Caractéristiques et avantages
This 1-part, reworkable epoxy underfill encapsulant is designed for Ball Grid Array (BGA), Chip Scale Packaging (CSP) and Wafer Level Chip Scale Package (WLCSPs) production. It is compatible with most lead-free solders.
LOCTITE® ECCOBOND UF 3812 is a halogen-free underfill that shows stable performance under thermal stress. This black-liquid, epoxy-based underfill showcases excellent thermal cycle performance and sturdy electrical performance under thermal and humid bias. It can be used with most Pb-free solders; is designed for the production of BGA, CSP and WLCSPs, and is formulated to flow at room temperature with no additional preheating required.
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Informations techniques
| Applications | Encapsulage, Sous-remplissage |
| Coefficient de dilatation thermique (CDT), Above Tg | 175.0 ppm/°C |
| Coefficient de dilatation thermique (CDT), Below Tg | 48.0 ppm/°C |
| Couleur | Noir |
| Module de stockage, DMA @ 25.0 °C 3-point bending | 3004.0 N/mm² (435580.0 psi ) |
| Programme de durcissement, @ 130.0 °C | 10.0 min |
| Temps de service | 1.0 jour |
| Température de stockage | -20.0 °C |
| Température de transition vitreuse | 131.0 °C |
| Type de polymérisation | Polymérisation par la chaleur |
| Vie en pot | 3.0 jour |
| Viscosité, Physica @ 25.0 °C Spindle CP50-1, Shear Rate 1,000 s⁻¹ | 350.0 mPa.s (cP) |
LOCTITE® ECCOBOND UF 3812
This 1-part, reworkable epoxy underfill encapsulant is designed for Ball Grid Array (BGA), Chip Scale Packaging (CSP) and Wafer Level Chip Scale Package (WLCSPs) production. It is compatible with most lead-free solders.