BERGQUIST® GAP PAD® TGP 3004SF
Poznat kao Gap Pad® 3004SF
Elementi i pogodnosti
This high-performance, thermally conductive, silicone-free gap pad filler has a thermal conductivity rating of 3.0 W/m-K for silicone-sensitive applications.
BERGQUIST® GAP PAD® TGP 3004SF is a silicone-free, thermally conductive gap pad. This product exhibits excellent thermal performance and thereby offers exceptionally low interfacial resistance to adjacent surfaces. It has no silicone content, so is ideal for silicone-sensitive applications.
Pročitajte više
Dokumenti i preuzimanja
Tražite tehničke listove ili bezbednosne listove na drugom jeziku?
Tehnički podaci
| Boja | Svetlo siva |
| Gustina, Maximum Final | 3.2 g/cm³ |
| Otpornost na plamen | V-0 |
| Radna temperatura | -40.0 - 125.0 °C |
| Standardna debljina | 0.254 - 3.715 mm |
| Tip nosača | PET premaz, 0,25 mil |
| Toplotna provodljivost | 3.0 W/mK |
| Tvrdoća po Šoru, Thirty second delay value, ASTM D2240 Guma u komadu @ 23.0 °C Shore 00 | 70.0 |
BERGQUIST® GAP PAD® TGP 3004SF
This high-performance, thermally conductive, silicone-free gap pad filler has a thermal conductivity rating of 3.0 W/m-K for silicone-sensitive applications.