BERGQUIST® GAP PAD® TGP 3004SF
Connu sous le nom de Gap Pad® 3004SF
Caractéristiques et avantages
This high-performance, thermally conductive, silicone-free gap pad filler has a thermal conductivity rating of 3.0 W/m-K for silicone-sensitive applications.
BERGQUIST® GAP PAD® TGP 3004SF is a silicone-free, thermally conductive gap pad. This product exhibits excellent thermal performance and thereby offers exceptionally low interfacial resistance to adjacent surfaces. It has no silicone content, so is ideal for silicone-sensitive applications.
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Informations techniques
| Conductivité thermique | 3.0 W/mK |
| Cote d'inflammabilité | V-0 |
| Couleur | Gris clair |
| Densité, Maximum Final | 3.2 g/cm³ |
| Dureté Shore, Thirty second delay value, ASTM D2240 Caoutchouc en vrac @ 23.0 °C Shore 00 | 70.0 |
| Température de service | -40.0 - 125.0 °C |
| Type porteur | Film PET 0,25 mil |
| Épaisseur standard | 0.254 - 3.715 mm |
BERGQUIST® GAP PAD® TGP 3004SF
This high-performance, thermally conductive, silicone-free gap pad filler has a thermal conductivity rating of 3.0 W/m-K for silicone-sensitive applications.