BERGQUIST® GAP PAD® TGP 3004SF
Tuntud kui Gap Pad® 3004SF
Omadused ja eelised
This high-performance, thermally conductive, silicone-free gap pad filler has a thermal conductivity rating of 3.0 W/m-K for silicone-sensitive applications.
BERGQUIST® GAP PAD® TGP 3004SF is a silicone-free, thermally conductive gap pad. This product exhibits excellent thermal performance and thereby offers exceptionally low interfacial resistance to adjacent surfaces. It has no silicone content, so is ideal for silicone-sensitive applications.
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Tehniline teave
| Arvestuslik leegikindlus | V-0 |
| Kanduri tüüp | 0,25 mil PET-kile |
| Shore’i kõvadus, Thirty second delay value, ASTM D2240 Puistkumm @ 23.0 °C Shore 00 | 70.0 |
| Soojusjuhtivus | 3.0 W/mK |
| Standardpaksus | 0.254 - 3.715 mm |
| Tihedus, Maximum Final | 3.2 g/cm³ |
| Töötemperatuur | -40.0 - 125.0 °C |
| Värvus | Helehall |
BERGQUIST® GAP PAD® TGP 3004SF
This high-performance, thermally conductive, silicone-free gap pad filler has a thermal conductivity rating of 3.0 W/m-K for silicone-sensitive applications.