BERGQUIST® GAP PAD® TGP 3500ULM
Conocido como Gap Pad® 3500ULM
Características y Ventajas
This thermally conductive, silicone-based gap pad filler has a thermal conductivity rating of 3.5 W/m-K and ultra low modulus (ULM).
BERGQUIST® GAP PAD® TGP 3500ULM is an extremely soft thermal interface material with a higher natural tack, eliminating the need for additional adhesive layers and providing stick-in-place characteristics during assembly. The specially designed formulation offers excellent thermal performance at low pressures and is highly conforming, allowing for excellent wet-out at the interface.
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Información técnica
| Color | Gris |
| Conductividad térmica | 3.5 W/mK |
| Espesor | 0.508 - 3.175 mm |
| Módulo de Young | 27.5 KPa (4.0 psi ) |
| Resistencia a la flama | V-0 |
| Temperatura de funcionamiento | -60.0 - 200.0 °C |
| Tipo de vehículo | Fibra de Vidrio, Sin fibra de vidrio |
BERGQUIST® GAP PAD® TGP 3500ULM
This thermally conductive, silicone-based gap pad filler has a thermal conductivity rating of 3.5 W/m-K and ultra low modulus (ULM).