BERGQUIST® GAP PAD® TGP 3500ULM
Connu sous le nom de Gap Pad® 3500ULM
Caractéristiques et avantages
This thermally conductive, silicone-based gap pad filler has a thermal conductivity rating of 3.5 W/m-K and ultra low modulus (ULM).
BERGQUIST® GAP PAD® TGP 3500ULM is an extremely soft thermal interface material with a higher natural tack, eliminating the need for additional adhesive layers and providing stick-in-place characteristics during assembly. The specially designed formulation offers excellent thermal performance at low pressures and is highly conforming, allowing for excellent wet-out at the interface.
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Informations techniques
| Conductivité thermique | 3.5 W/mK |
| Cote d'inflammabilité | V-0 |
| Couleur | Gris |
| Module de Young | 27.5 KPa (4.0 psi ) |
| Température de service | -60.0 - 200.0 °C |
| Type porteur | Fibre de verre, Sans fibre de verre |
| Épaisseur standard | 0.508 - 3.175 mm |
BERGQUIST® GAP PAD® TGP 3500ULM
This thermally conductive, silicone-based gap pad filler has a thermal conductivity rating of 3.5 W/m-K and ultra low modulus (ULM).