LOCTITE® ECCOBOND F 112
Características e Benefícios
This low viscosity, 2-part, non-conductive adhesive is specially formulated for fiber optic assembly applications. It is resistant to both thermal shock and impact.
LOCTITE® ECCOBOND F 112 is a 2-part, low viscosity, electrically non-conductive adhesive for fiber optic assembly applications. It is thermal shock and impact resistant, and offers low stress connections with no pistoning. It’s also ideal for multimode and single mode connectors, and small potting and sealing applications.
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Informação Técnica
| Cronograma de cura, @ 25.0 °C | 1.0 hr. |
| Força de cisalhamento, Alumínio | 3000.0 psi |
| Número de componentes | Bicomponente |
| Temperatura de armazenamento | 27.0 °C |
| Tipo de cura | Cura por Calor |
| Viscosidade, @ 25.0 °C | 1800.0 mPa.s (cP) |
| Índice tixotrópico | 1.0 |
LOCTITE® ECCOBOND F 112
This low viscosity, 2-part, non-conductive adhesive is specially formulated for fiber optic assembly applications. It is resistant to both thermal shock and impact.