LOCTITE® ECCOBOND F 112
Merkmale und Vorteile
This low-viscosity, 2-part, non-conductive adhesive is specially formulated for fibre-optic assembly applications. It is resistant to both thermal shock and impact.
LOCTITE® ECCOBOND F 112 is a 2-part, low-viscosity, electrically non-conductive adhesive for fibre-optic assembly applications. It is thermal shock- and impact-resistant, and offers low stress connections with no pistoning. It’s also ideal for multi-mode and single mode connectors, and small potting and sealing applications.
Weiterlesen
Dokumente und Downloads
Suchen Sie nach einem TDS oder SDS in einer anderen Sprache?
Technische Informationen
| Anzahl Komponenten | 2K |
| Aushärtetechnik | Aushärtung durch Wärme |
| Aushärtezyklus, @ 25.0 °C | 1.0 h |
| Lagertemperatur | 27.0 °C |
| Scherfestigkeit, Aluminium | 3000.0 psi |
| Thixotropie Index | 1.0 |
| Viskosität, @ 25.0 °C | 1800.0 mPa.s (cP) |
LOCTITE® ECCOBOND F 112
This low-viscosity, 2-part, non-conductive adhesive is specially formulated for fibre-optic assembly applications. It is resistant to both thermal shock and impact.