BERGQUIST® SIL PAD® TSP Q2000
Conocido como Q-Pad® 3
Características y Ventajas
This thermally conductive, fiberglass-reinforced silicone insulator pad is suitable for applications prior to soldering and cleaning. Easy handling, low thermal impedance.
BERGQUIST® SIL PAD® TSP Q2000 eliminates problems associated with thermal grease, such as contamination of electronic assemblies and reflow solder baths. It can be installed prior to soldering and cleaning without worry. When clamped between two surfaces, the elastomer conforms to surface textures thereby creating an air-free interface between heat-generating components and heat sinks. Fiberglass reinforcement enables it to withstand processing stresses without losing physical integrity. It also provides ease of handling during application.
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Información técnica
| Color | Negro |
| Conductividad térmica | 0.2 W/mK |
| Resistencia a la flama | V-0 |
| Temperatura de funcionamiento | -60.0 - 180.0 °C |
| Tipo de vehículo | Fibra de Vidrio |
Preguntas frecuentes
¿Cómo puedo saber cuál producto SIL PAD es el adecuado para mi aplicación específica?
¿Qué es IS09001:2008?
BERGQUIST® SIL PAD® TSP Q2000
This thermally conductive, fiberglass-reinforced silicone insulator pad is suitable for applications prior to soldering and cleaning. Easy handling, low thermal impedance.