BERGQUIST® GAP PAD® TGP 2400
Connu sous le nom de Gap Pad® 2500S20
Caractéristiques et avantages
This thermally conductive, silicone-based, fiberglass-reinforced gap pad filler has a thermal conductivity rating of 2.4 W/m-K. Perfect for low stress sensitive applications.
BERGQUIST® GAP PAD® TGP 2400 is a pre-cured, silicone-based, thermally conductive reinforced gap pad. It is highly conformable, exhibits thermal resistance and softness, and is fiberglass reinforced and therefore offers resistance against puncture, shear and tear. This product is well suited for high performance, low stress sensitive applications.
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Informations techniques
| Capacité thermique, ASTM E1269 | 1.0 J/g-K |
| Conductivité thermique | 2.4 W/mK |
| Constante diélectrique, @ 1kHz | 6.6 |
| Cote d'inflammabilité | V-0 |
| Couleur | Jaune clair |
| Densité | 3.1 g/cm³ |
| Dureté Shore, Thirty second delay value, ASTM D2240 Caoutchouc en vrac Shore 00 | 20.0 |
| Résistivité volume | 1×10 Ohm m |
| Tension de rupture diélectrique | 3000.0 Vac |
| Épaisseur standard | 0.254 - 6.35 mm |
BERGQUIST® GAP PAD® TGP 2400
This thermally conductive, silicone-based, fiberglass-reinforced gap pad filler has a thermal conductivity rating of 2.4 W/m-K. Perfect for low stress sensitive applications.