BERGQUIST® GAP PAD® TGP EMI1000
Connu sous le nom de Gap Pad® EMI 1.0
Caractéristiques et avantages
This thermally conductive, silicone-based, fiberglass reinforced, highly conformable gap pad filler provides EMI attenuation at frequencies of 1GHz and higher.
BERGQUIST® GAP PAD® TGP EMI1000 is a highly conformable, fiberglass reinforced, combination gap filling material. It offers both thermal conductivity performance and electromagnetic energy absorption (cavity resonances and/or cross-talk causing electromagnetic interference) at frequencies of 1GHz and higher. You can expect EMI attenuation and 1.0 W/m-K thermal conductivity performance with low assembly stress, and the soft nature of the material enhances wet-out at the interface, resulting in better thermal performance than harder materials with a similar performance rating. It has an inherent natural tack on one side of the material for improved handling and no more thermally-impeding adhesive layers. The other side is tack-free, enhancing handling and rework when you need it. It’s supplied with a protective liner on the material’s tacky side.
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Informations techniques
| Capacité thermique, ASTM E1269 | 1.3 J/g-K |
| Conductivité thermique | 1.0 W/mK |
| Constante diélectrique, @ 1kHz | 6.0 |
| Cote d'inflammabilité | V-0 |
| Couleur | Noir |
| Densité | 2.4 g/cm³ |
| Dureté Shore, Thirty second delay value, ASTM D2240 Caoutchouc en vrac Shore 00 | 5.0 |
| Résistivité volume | 1×10 Ohm m |
| Température de service | -60.0 - 200.0 °C |
| Tension de rupture diélectrique | 1700.0 Vac |
| Épaisseur standard | 0.508 - 3.175 mm |
BERGQUIST® GAP PAD® TGP EMI1000
This thermally conductive, silicone-based, fiberglass reinforced, highly conformable gap pad filler provides EMI attenuation at frequencies of 1GHz and higher.