BERGQUIST® GAP PAD® TGP 3000
Connu sous le nom de Gap Pad® 3000S30
Caractéristiques et avantages
This thermally conductive, silicone-based, fiberglass-reinforced gap pad filler has a high thermal conductivity rating of 3.0 W/m-K. Ideal for stress-sensitive applications.
BERGQUIST® GAP PAD TGP 3000 is a pre-cured, silicone based, thermally conductive, reinforced gap pad. It is highly conformable and exhibits thermal resistance and softness. It is fiberglass-reinforced and therefore offers resistance against puncture, shear and tear. This product is well suited for high performance, low stress sensitive applications.
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Informations techniques
| Capacité thermique, ASTM E1269 | 1.0 J/g-K |
| Constante diélectrique, ASTM D150 @ 1kHz | 7.0 |
| Cote d'inflammabilité | V-0 |
| Couleur | Bleu clair |
| Densité | 3.2 g/cm³ |
| Dureté Shore, Thirty second delay value, ASTM D2240 Caoutchouc en vrac Shore 00 | 30.0 |
| Résistivité volume | 1×10 Ohm m |
| Température de service | -60.0 - 200.0 °C |
| Tension de rupture diélectrique | 3000.0 Vac |
| Épaisseur standard | 0.254 - 3.175 mm |
BERGQUIST® GAP PAD® TGP 3000
This thermally conductive, silicone-based, fiberglass-reinforced gap pad filler has a high thermal conductivity rating of 3.0 W/m-K. Ideal for stress-sensitive applications.