BERGQUIST® GAP FILLER TGF 3600
Connu sous le nom de Gap Filler 3500S35
Caractéristiques et avantages
This highly thermally conductive liquid gap filler is designed for easy, precision dispensing and low stress assembly. It has excellent low- and high-temperature, mechanical and chemical stability.
BERGQUIST® GAP FILLER TGF 3600 is a 3.6 W/m-K thermally conductive, ultra conforming, silicone-based liquid gap filler (2-part). It exhibits ultra-high thermal performance and superior softness. This product has low modulus to help relieve coefficient of thermal expansion (CTE) stresses in thermal cycling and provide excellent vertical gap stability. It can be used for fragile and low stress applications in various fields. This product is curable at room temperature. However, the cure rate can be accelerated with the application of heat.
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Informations techniques
| Conductivité thermique | 3.6 W/mK |
| Cote d'inflammabilité | V-0 |
| Température de service | -60.0 - 200.0 °C |
| Type de polymérisation | Polymérisation par la chaleur |
| Résine | |
| Couleur, Résine | Blanc |
| Mélange | |
| Couleur, Mélange | Bleu |
| Durcisseur | |
| Couleur, Durcisseur | Bleu |
BERGQUIST® GAP FILLER TGF 3600
This highly thermally conductive liquid gap filler is designed for easy, precision dispensing and low stress assembly. It has excellent low- and high-temperature, mechanical and chemical stability.