BERGQUIST® GAP FILLER TGF 1400SL
Connu sous le nom de Gap Filler 1400SL
Caractéristiques et avantages
This self-leveling, thermally conductive, silicone-based liquid gap filler is designed for heat transfer and vibration dampening. It has excellent low and high temperature stability.
BERGQUIST® GAP FILLER TGF 1400SL is a 2-part, silicone based, thermally conductive liquid gap filler. Its low viscosity enables self-leveling and filling of unique and intricate gaps, resulting in excellent thermal transfer and vibration dampening. It can be used with infinite thickness variations and for fragile assemblies with less or no stress to the components. It’s curable at room temperature, but you can speed up the cure by applying heat.
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Informations techniques
| Conductivité thermique | 1.4 W/mK |
| Cote d'inflammabilité | V-0 |
| Température de service | -60.0 - 200.0 °C |
| Type de polymérisation | Polymérisation par la chaleur |
| Résine | |
| Couleur, Résine | Jaune |
| Mélange | |
| Couleur, Mélange | Jaune |
| Durcisseur | |
| Couleur, Durcisseur | Blanc |
BERGQUIST® GAP FILLER TGF 1400SL
This self-leveling, thermally conductive, silicone-based liquid gap filler is designed for heat transfer and vibration dampening. It has excellent low and high temperature stability.